Passive Components High Density Electronic Circuits To Assemble

FPC (Flexible Printed Circuits) Product

High-Density Multi-layer FPC

Sumitomo Electric provides high density and rigidized multi-layer FPC which are critical for achieving the driving forces in functional density and size reduction to support current product packaging needs.
We are also able to provide fully assembled interconnects, allowing for fully functional and tested interconnect sub-components.

We recommend that design matters be discussed as soon as possible with our engineering or technical sales staff.

Component Mounted FPC

The use of FPC product technologies has been widely expanded due to functional component assembly and various connection technologies.

With our broad range of experience, products and capabilities, we are able to provide fully integrated FPC assembly solutions.

FPC Insulated with Liquid Polyimide (Non-Halogen Type)

Our development of high density interconnect products not only takes into consideration capability performance but also environmental conditions for various market segments. The development of liquid polyimide dielectric provides for achievement in high functional density but also meets future objectives for environmental industry standards.

Sumitomo Electric product development has created characteristics for excellent process control, as well as flexibility and dielectric performance.

The ability for us to create a halogen-free material composite results in our capabilities to meet standard UL V-0 requirements.

Product development has provided for the application of this liquid polyimide dielectric technology in screened or photo-imageable material forms based on application needs.

Strong Points

1.A global system of production

2.High quality

3.A track record of being adopted by the top makers in various industries